TLP137(TPR,F)

Description：OPTOISO 3.75KV TRAN BASE 6MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:d344b71d457e Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV TRAN BASE 6MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：100% @ 1mA
Current Transfer Ratio (Max)：1200% @ 1mA
Turn On / Turn Off Time (Typ)：10µs, 8µs
Rise / Fall Time (Typ)：8µs, 8µs
Input Type：DC
Output Type：Transistor with Base
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 100°C
Mounting Type：Surface Mount
Package / Case：6-SOIC (0.173", 4.40mm Width), 5 Leads
Supplier Device Package：6-MFSOP, 5 Lead

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TLP137(TPR,F)

Overview

The TLP137(TPR,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a phototransistor in an MFSOP-6 surface-mount package. The device provides high current transfer ratio at low input currents, featuring a minimum collector-emitter voltage of 80 V and an isolation voltage of 3750 Vrms. It is designed for applications requiring compact size and reliable signal transmission.

Feature Summary

Integrates a gallium arsenide infrared LED coupled to a phototransistor for efficient optical signal transmission.
Provides high current transfer ratio performance even at low input drive currents.
Features a mini flat outline (MFSOP-6) package suitable for automated surface mount assembly processes.

Applications

Office machines
Programmable controllers
AC/DC input modules
Telecommunication equipment

Procurement Notes

Verify the specific suffix (TPR,F) against official Toshiba documentation to confirm tape-and-reel packaging and lead-free status. Confirm component availability as distribution channels may list obsolete or discontinued stock. Ensure the source document explicitly identifies Toshiba Semiconductor and Storage as the manufacturer for this part number.

Selection Notes

Select this component when a compact surface-mount solution is required for digital signal isolation. The MFSOP-6 package offers space savings compared to traditional DIP formats. Verify that the 80 V collector-emitter voltage rating meets the load requirements of the target circuit design.

Part Context

This component belongs to the Toshiba TLP13x series of mini flat couplers. These devices are engineered for high-density PCB layouts where standard packages cannot fit. The series maintains consistent electrical characteristics across variants while differing primarily in packaging and reel specifications.