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The TLP183(BL,E is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates an infrared LED and a phototransistor in a 6-SOP package to provide electrical isolation between input and output circuits. Key electrical parameters include a maximum collector-emitter voltage of 80V, a peak forward current of 50 mA, and a typical forward voltage of 1.25V. The device offers a high current transfer ratio ranging from 200% to 600% at a forward current of 5 mA. It supports a wide operating temperature range from -55°C to 125°C and provides an isolation voltage of 3750Vrms.
Verify the specific suffix designation against official Toshiba documentation to confirm exact packaging and compliance status. Ensure the component matches the required isolation voltage and thermal specifications for the target application environment. Cross-reference manufacturer part numbers with authorized distributor listings to confirm authenticity and availability. Confirm RoHS3 compliance requirements align with project standards before finalizing procurement orders.
Select this component when high current transfer ratio performance is required for low-drive applications. The 80V output voltage rating suits general-purpose switching tasks. Verify that the 6-SOP footprint fits the design constraints. Consider the 3750Vrms isolation capability for safety-critical interfaces. Evaluate the -55°C to 125°C range against environmental conditions.
This device belongs to the TLP183 series of low-current input transistor optocouplers. The series is designed for general-purpose isolation in digital and analog circuits. Toshiba utilizes this platform for various configurations differing primarily in packaging and compliance markings. The BL variant specifically denotes the standard commercial grade configuration within this family line.
TLP183(GB,E and TLP183(GRL-TPL,E are documented variants within the same product family. These alternatives share identical core electrical characteristics but may differ in packaging format or regulatory compliance markings. Verify pinout compatibility and isolation ratings before substitution.