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Product Detailed Parameters
- Description：OPTOISO 3.75KV 1CH TRANS 6-SOP
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR),Cut Tape (CT)
- Number of Channels：1
- Voltage - Isolation：3750Vrms
- Current Transfer Ratio (Min)：100% @ 5mA
- Current Transfer Ratio (Max)：300% @ 5mA
- Turn On / Turn Off Time (Typ)：9µs, 9µs
- Rise / Fall Time (Typ)：5µs, 9µs
- Input Type：DC
- Output Type：Transistor
- Voltage - Output (Max)：80V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.25V
- Current - DC Forward (If) (Max)：50 mA
- Vce Saturation (Max)：300mV
- Operating Temperature：-55°C ~ 110°C
- Mounting Type：Surface Mount
- Package / Case：6-SOIC (0.173", 4.40mm Width), 4 Leads
- Supplier Device Package：6-SOP
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Overview
The TLP185(GR-TPR,E) is a transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates an aluminum gallium arsenide infrared LED with a phototransistor in a compact surface-mount package. The device provides electrical isolation with a rated insulation voltage of 3750 Vrms. Key electrical parameters include a collector-emitter voltage of 80V, a maximum forward current of 50mA, and a minimum collector current of 50mA. The current transfer ratio ranges from 100% to 300%. Switching characteristics feature typical rise and fall times of 2µs and 3µs respectively. It operates within a temperature range of -55°C to +110°C.
Feature Summary
- Provides high-voltage electrical isolation between input and output circuits using optical coupling technology.
- Features a fast switching response suitable for medium-speed signal transmission applications.
- Delivers high current transfer efficiency to ensure reliable driving capability for downstream loads.
Applications
- Industrial control system I/O interface isolation
- AC/DC input module signal isolation
- Programmable logic controller (PLC) circuit interfacing
Procurement Notes
Verify the specific suffix designation to confirm the exact binning grade and packaging configuration, as variations exist within the TLP185 series. Confirm that the component status aligns with project requirements, noting that some variants may carry end-of-life designations. Ensure compliance with relevant safety standards such as UL1577 and EN60747-5-2 for the intended application environment.
Selection Notes
Select this component when high isolation voltage and moderate speed are required for single-channel signal transmission. Consider the current transfer ratio specifications to ensure adequate drive margin for the load. Evaluate the thermal management requirements given the power dissipation limits and operating temperature range. Verify that the surface-mount package dimensions fit the available PCB space constraints.
Part Context
This device belongs to the TLP185 family of small outline optocouplers designed for surface mounting. The series offers various suffix options to accommodate different current transfer ratios and packaging formats. These components are engineered to replace traditional through-hole optocouplers in space-constrained designs while maintaining robust isolation performance and reliability standards.
Replacement Considerations
Direct replacements include other Toshiba TLP185 variants with matching pinouts and electrical characteristics. Cross-reference datasheets to verify compatibility regarding isolation voltage ratings and switching speeds before substituting with components from other manufacturers.
