TLP185(Y,SE

TLP185(Y,SE

  • Description:OPTOISO 3.75KV TRANS W/BASE 6SOP
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Bulk

SKU:8c033977239a Category: Brand:

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Product Detailed Parameters

  • Description:OPTOISO 3.75KV TRANS W/BASE 6SOP
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Bulk
  • Number of Channels:1
  • Voltage - Isolation:3750Vrms
  • Current Transfer Ratio (Min):50% @ 5mA
  • Current Transfer Ratio (Max):150% @ 5mA
  • Turn On / Turn Off Time (Typ):3µs, 3µs
  • Rise / Fall Time (Typ):2µs, 3µs
  • Input Type:DC
  • Output Type:Transistor with Base
  • Voltage - Output (Max):80V
  • Current - Output / Channel:50mA
  • Voltage - Forward (Vf) (Typ):1.25V
  • Current - DC Forward (If) (Max):50 mA
  • Vce Saturation (Max):300mV
  • Operating Temperature:-55°C ~ 110°C
  • Mounting Type:Surface Mount
  • Package / Case:6-SOIC (0.173", 4.40mm Width), 4 Leads
  • Supplier Device Package:6-SOP
  • Grade:-
  • Qualification:-

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TLP185(Y,SE

Overview

The TLP185(Y,SE) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates an aluminum gallium arsenide infrared LED with a phototransistor in a compact SO-6 surface-mount package. The device provides electrical isolation between input and output circuits, featuring a minimum isolation voltage of 3750Vrms. Key electrical parameters include a collector-emitter breakdown voltage of 80V and a maximum forward current of 20mA. The unit operates within a temperature range of -55°C to +110°C.

Feature Summary

  • Provides high-voltage electrical isolation between input and output circuits using an infrared LED and phototransistor configuration.
  • Features a compact SO-6 surface-mount package designed for automated assembly processes.
  • Offers wide operating temperature range suitable for demanding industrial environments.

Applications

  • Office equipment signal transmission
  • Programmable controller I/O interfaces
  • AC/DC input module isolation
  • Telecommunications interface protection

Procurement Notes

Verify the specific suffix designation when ordering, as it determines packaging format and binning criteria. Confirm RoHS compliance status through official documentation prior to integration. Ensure supply chain partners provide valid certificates of conformity. Cross-reference datasheet revisions to confirm parameter stability. Validate component authenticity through authorized distribution channels only.

Selection Notes

Select this component for applications requiring moderate speed signal isolation with compact footprint constraints. Consider the specific Current Transfer Ratio (CTR) bin required for the target circuit design. Evaluate thermal management requirements based on the specified power dissipation limits. Compare against alternative models if higher switching speeds or different isolation ratings are necessary for the specific application scenario.

Part Context

This part belongs to the TLP185 series of small flat couplers from Toshiba. The series includes variants with different CTR specifications and safety certifications. These devices are widely used in general-purpose isolation applications where space saving and reliable performance are prioritized over ultra-high-speed switching capabilities.

Replacement Considerations

Direct substitutes include other Toshiba TLP185 variants such as TLP185(GB,SE) or TLP185(GR,SE), provided the CTR requirements match. Verify pinout compatibility and package dimensions before substitution. Check isolation voltage ratings to ensure they meet or exceed the original design specifications.

TLP185(Y,SETLP185(Y,SE

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