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TLP2160(F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 2.5KV 2CH PUSH PULL 8-SO. Review the specifications below when checking this part for your BOM.
The TLP2160(F) is a high-speed optocoupler featuring two channels in an SO-8 surface-mount package. It integrates a GaAlAs LED with a photodiode-transistor output, providing 2500Vrms isolation voltage. The device supports a data rate of 20MBd with typical propagation delays of 40ns for both rise and fall times. Operating parameters include a maximum forward current of 25mA, a typical forward voltage of 1.55V, and an output current capability of 10mA per channel. It functions within a temperature range of -40°C to +125°C.
Verify the specific suffix (F) indicates tape-and-reel packaging if required by assembly equipment. Confirm RoHS compliance status through official Toshiba documentation. Ensure the selected distributor provides genuine Toshiba Semiconductor and Storage products to guarantee performance specifications and traceability.
Select this component when dual-channel isolation with push-pull outputs is required. It is suitable for applications needing high common-mode transient immunity and fast switching speeds. Compare against single-channel alternatives if only one isolation barrier is needed. Verify that the 10mA output current meets the load requirements of the receiving circuitry.
This part belongs to the TLP2160 series of high-speed optocouplers from Toshiba. The series utilizes GaAlAs LEDs coupled with photodiode-transistor chips to achieve high speed and reliability. The TLP2160(F) specifically denotes the version packaged in SO-8 format, designed for surface-mount technology applications requiring compact footprints.
Check for pin-compatible alternatives such as the TLP2168 if higher output current or different isolation ratings are acceptable. Verify that any substitute maintains the 20MBd data rate and 2500Vrms isolation specification. Ensure the replacement supports the same SO-8 package dimensions and thermal characteristics.
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