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TLP2363(TPR,E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 3.75KV OPEN COLL S-O6. Review the specifications below when checking this part for your BOM.
The TLP2363(TPR,E is a high-speed photocoupler featuring one channel with an open collector output. It supports data rates up to 10 MBd and provides 3750 Vrms isolation voltage. The device operates within a supply voltage range of 2.7V to 5.5V and withstands a minimum common-mode transient immunity of 20 kV/µs. Electrical characteristics include a maximum forward current of 25 mA, typical forward voltage of 1.5 V, and output current capability of 25 mA. Propagation delays are typically 80 ns for both rise and fall times, with specific transition times of 23 ns rise and 7 ns fall. Power dissipation is rated at 100 mW, and the unit functions between -40°C and +105°C.
Verify the exact suffix (TPR,E) against the manufacturer's official datasheet to confirm package type and tape/reel specifications. Ensure the procurement source provides valid RoHS compliance documentation. Cross-reference the part number with Toshiba Semiconductor and Storage catalogs to avoid confusion with similar variants like TLP2362 or TLP2366 which may have different output structures or pinouts.
Select this component when designing circuits requiring high-speed digital isolation with open collector outputs. It is appropriate for applications needing robust common-mode noise rejection and wide operating temperature ranges. Consider the 6-SOIC package constraints and verify that the system voltage aligns with the 2.7V to 5.5V supply requirement. Evaluate propagation delay specifications against the target data rate to ensure signal integrity.
This device belongs to the TLP2363 series of high-speed optocouplers manufactured by Toshiba Semiconductor and Storage. The series is engineered for reliable digital isolation in compact surface-mount packages. The TPR,E suffix indicates specific packaging and environmental compliance attributes defined by the manufacturer. These components are widely used in modern electronic systems where space efficiency and signal speed are critical design factors.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative models such as TLP2362(V4-TPL,E only if the application can accommodate differences in output structure, such as open collector versus push-pull configurations, and ensure pinout alignment.
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