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TLP2395(TPL,E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 3.75KV PUSH PULL 6-SO. Review the specifications below when checking this part for your BOM.
The TLP2395(TPL,E is a high-speed optocoupler manufactured by Toshiba Semiconductor and Storage. It features a single channel with a data rate of 5 Mb/s and an isolation voltage of 3750 Vrms. The device utilizes a GaAlAs infrared LED coupled with a high-gain, high-speed photodetector. Key electrical parameters include a forward current of 3 mA, forward voltage of 1.5 V, and output current of 25 mA. Timing characteristics specify a rise time of 15 ns and a fall time of 12 ns. The component operates within a temperature range of -40°C to +125°C and is housed in an SO-6-5 package.
Verify the specific ordering suffix matches the required packaging format, such as tape and reel or cut tape, as indicated in distributor catalogs. Confirm RoHS compliance status through official documentation before integration. Ensure the SO-6-5 package dimensions align with the target PCB footprint design constraints. Cross-reference the manufacturer part number with authorized distributors to guarantee authenticity and traceability of the semiconductor components.
Select this component when applications demand high-speed data transfer rates up to 5 Mb/s alongside significant isolation requirements. The low propagation delay makes it suitable for timing-sensitive digital circuits. Consider the operating temperature range of -40°C to +125°C for environments with thermal variability. The compact SO-6-5 package facilitates space-constrained board layouts while maintaining necessary clearance distances for safety standards.
This device belongs to Toshiba's series of high-speed photocouplers designed for reliable digital isolation. It combines an infrared emitting diode with a specialized photodetector IC to achieve fast switching speeds. The family is engineered for industrial applications where signal integrity and electrical safety are critical. The specific model variant includes packaging specifications tailored for automated surface-mount assembly processes.
Consult official Toshiba substitution guides for compatible alternatives. Verify that any replacement maintains the same pinout configuration, isolation voltage rating, and data speed capabilities. Ensure the alternative device supports the required SO-6-5 package style for direct board compatibility without redesign.
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