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TLP2631TP1F is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 2.5KV 2CH OPN COLL 8-SMD. Review the specifications below when checking this part for your BOM.
The TLP2631TP1F is a dual-channel optoisolator manufactured by Toshiba Semiconductor and Storage. It features an open collector output with Schottky clamping, providing high-speed logic isolation capabilities. The device offers a data rate of 10MBd and a common-mode transient immunity (CMTI) of 1kV/µs. Electrical specifications include a maximum forward current of 50mA, a typical forward voltage of 1.25V, and a saturation voltage of 300mV. The unit supports a supply voltage range of 4.5V to 5.5V and operates within a temperature range of -40°C to 85°C.
Verify the specific suffix TP1F confirms the tape-and-reel packaging format required for surface-mount assembly processes. Confirm that the RoHS compliance status aligns with current environmental regulations for your manufacturing region. Ensure the operating temperature range meets the thermal requirements of the final application environment before procurement.
Select this component when dual-channel isolation with Schottky-clamped outputs is required for high-speed digital signals. The 10MBd data rate suits applications needing faster response than standard transistor-output couplers. Verify that the 1kV/µs CMTI rating is sufficient for the noise environment. Ensure the 50mA input current limit accommodates the driving circuit capabilities.
This part belongs to the TLP2631 family of dual photocouplers from Toshiba. The series utilizes GaAlAs LEDs paired with integrated high-gain photodetectors. The TLP2631TP1F variant specifically denotes the surface-mount package configuration. This family is designed for robust isolation in data transmission and logic interface applications.
Direct substitutes must match the dual-channel open-collector configuration with Schottky clamping. Verify equivalent speed ratings and isolation voltages. Check for compatible pinout and package dimensions to ensure mechanical fit without redesigning the PCB layout.
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