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TLP267J(TPL,E is listed in the Triac, SCR Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLTR 3.75KV TRIAC 1CH 6SOP. Review the specifications below when checking this part for your BOM.
The TLP267J is a high-speed phototransistor output optocoupler featuring a GaAlAs LED coupled to a phototransistor. It provides electrical isolation between input and output circuits with a high common-mode transient immunity of 15 kV/µs. The device supports a data transmission rate up to 10 Mbps, making it suitable for digital signal isolation in industrial applications. Key electrical characteristics include a collector-emitter voltage of 80 V and a forward current of 50 mA. The unit is available in an 8-pin DIP package, ensuring compatibility with standard PCB layouts.
Verify the specific ordering suffix matches the required packaging configuration. Confirm that the component meets all relevant safety standards for your target market. Check the manufacturer's latest datasheet for any updates on recommended operating conditions. Ensure proper handling procedures are followed during assembly to maintain device integrity.
Consider the required isolation voltage and data speed when evaluating this component against alternatives. Assess the power consumption requirements of the LED driver circuitry. Verify that the package dimensions fit within the mechanical constraints of the design. Review the thermal management needs for continuous operation at maximum ratings.
This component belongs to Toshiba's family of high-speed optocouplers designed for robust signal transmission. It complements other models offering varying speeds and isolation levels. The series is engineered for reliability in demanding electronic environments. Engineers often select these devices for their balance of performance and cost-effectiveness in isolation applications.
Check for direct pin-compatible substitutes from Toshiba or other manufacturers. Verify that alternative components meet or exceed the original isolation and speed specifications. Ensure that the replacement part maintains the same package type for seamless integration.
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