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TLP2761F(F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLTR 5KV PUSH PULL 6-SO. Review the specifications below when checking this part for your BOM.
The TLP2761F(F) is a logic output optoisolator manufactured by Toshiba Semiconductor and Storage. It features a push-pull, totem pole output configuration designed for high-speed signal transmission. The device provides electrical isolation with a rated voltage of 5000Vrms across one channel. It supports data rates up to 15MBd and offers a common-mode transient immunity (CMTI) of 20kV/µs. The component operates within a supply voltage range of 2.7V to 5.5V and is housed in a compact 6-SOIC package with a width of 7.50mm.
Verify the specific suffix F against the manufacturer's current datasheet to confirm pinout compatibility and packaging dimensions. Ensure the selected variant matches the required operating temperature range and insulation specifications for the target application. Cross-reference the part number with official Toshiba documentation to avoid confusion with similar models like the TLP2761F(TP,F).
Select this component when high-speed logic isolation is required with minimal propagation delay. The push-pull output eliminates the need for external pull-up resistors, simplifying circuit design. Consider the 5000Vrms isolation rating for safety-critical applications. Verify that the 15MBd speed meets the system's data throughput requirements before finalizing the selection.
This device belongs to Toshiba's series of high-speed logic output optocouplers. It is engineered to replace slower relay-based or standard transistor-output isolators in modern digital circuits. The integration of a totem pole output stage enhances performance in applications demanding rapid signal transitions and reliable noise immunity.
Direct substitutes may include other Toshiba logic output optocouplers with identical pinouts and electrical characteristics. Verify compatibility with existing PCB footprints and thermal management requirements. Consult official replacement guides for any updated versions or enhanced performance variants within the same product family.
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