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TLP2768F(D4-TP,F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 5KV OPEN COLL 6-DIP GW. Review the specifications below when checking this part for your BOM.
The TLP2768F(D4-TP,F) is a high-speed logic output optoisolator manufactured by Toshiba Semiconductor and Storage. It integrates a high-output GaAlAs infrared LED with an integrated high-gain, high-speed photodetector featuring open collector output and Schottky clamp. The device supports data rates up to 20MBd and provides 5000Vrms isolation voltage. It operates within a supply voltage range of 2.7V to 5.5V and features a common mode transient immunity (CMTI) of 20kV/µs. The component is housed in a 6-SDIP gull wing package and functions reliably across an operating temperature range of -40°C to 125°C.
Verify the specific suffix D4-TP,F against the manufacturer's latest datasheet to confirm pinout compatibility and packaging specifications. Ensure that the 6-SDIP gull wing package dimensions match your PCB footprint requirements. Confirm RoHS compliance status and moisture sensitivity level prior to assembly planning. Cross-reference the part number with official Toshiba documentation to avoid substitution errors with similar models in the TLP2768 series.
Select this component when high-speed data transmission up to 20MBd is required alongside strong isolation capabilities. The integrated Schottky clamp makes it suitable for applications demanding rapid turn-off times without storage delay. Consider the wide operating temperature range for harsh industrial environments. The open collector output requires appropriate pull-up resistor selection based on the target logic voltage levels.
This device belongs to the TLP2768 family of high-speed photocouplers from Toshiba Semiconductor and Storage. The family is designed to replace slower relay or standard optocoupler solutions in modern digital circuits. The TLP2768F variant specifically utilizes a SDIP package configuration, distinguishing it from surface-mount SOIC versions like the TLP2768A. These components are engineered for reliable operation in noise-sensitive electronic systems.
Public confirmed substitute part numbers include TLP2768A(D4-TP,E(T). Verify pinout compatibility between SDIP and SOIC packages if physical space constraints differ. Ensure equivalent isolation voltage and data rate specifications are maintained during substitution.
The device supports a maximum data rate of 20MBd.
Yes, the photodetector output includes an integrated Schottky clamp to prevent saturation.
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