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TLP2770(D4,E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLTR 5KV PUSH PULL 6-SO. Review the specifications below when checking this part for your BOM.
The TLP2770(D4,E is a high-speed photocoupler manufactured by Toshiba Semiconductor and Storage, housed in a compact SOIC-6 surface-mount package. It features a single channel with a data rate of 20 Mbps and an isolation voltage of 5000 Vrms. The device utilizes a totem pole output configuration capable of sourcing or sinking 10 mA. Key electrical parameters include a forward current of 1.3 mA, a typical forward voltage of 1.5 V, and a reverse voltage rating of 5 V. Power dissipation is rated at 40 mW, with operating temperatures ranging from -40°C to +125°C.
Verify the specific suffix (D4,E) against the manufacturer's latest datasheet to confirm pinout compatibility and packaging variations. Ensure that the required operating temperature range aligns with the specified -40°C to +125°C limits. Confirm that the 10 mA output current capacity meets the load requirements of the connected circuitry before finalizing procurement decisions.
Select this component when high-speed digital isolation is required within a small form factor. The 20 Mbps data rate supports modern serial communication protocols. Ensure the driving circuit can provide the necessary 1.3 mA forward current. The totem pole output simplifies interface design compared to open-collector alternatives, reducing external component count.
This device belongs to Toshiba's TLP2770 series of high-speed optocouplers. The series is designed for applications demanding fast switching speeds and reliable isolation in compact packages. The D4,E suffix typically denotes specific tape-and-reel packaging or manufacturing lot characteristics defined by the manufacturer.
Consult official substitution guides for equivalent high-speed optocouplers with matching 20 Mbps rates and 5000 Vrms isolation. Verify pin-to-pin compatibility if replacing in existing designs. Ensure alternative components support the same SOIC-6 package dimensions and thermal characteristics.
The device supports a maximum data rate of 20 Mbps.
It features a totem pole (push-pull) output type.
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