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TLP2962(F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 5KV OPEN COLLECTOR 8-DIP. Review the specifications below when checking this part for your BOM.
The TLP2962(F) is a high-speed logic output optocoupler manufactured by Toshiba Semiconductor and Storage. It features a single channel with an infrared LED input and an open collector phototransistor output, housed in an 8-DIP package. The device supports a data rate of 15 MBd and offers a minimum common-mode transient immunity of 20 kV/µs. Electrical specifications include a maximum propagation delay of 75 ns for both rising and falling edges, with rise and fall times of 3 ns and 12 ns respectively. It operates within a supply voltage range of 2.7 V to 5.5 V and provides an isolation voltage of 5000 Vrms.
Verify the specific suffix designation when ordering, as packaging formats vary between tube (F) and reel/cut tape configurations. Confirm that the selected variant matches the required installation style, such as through-hole DIP or surface mount SMD. Ensure compliance with RoHS3 standards if applicable to the target assembly process. Cross-reference the datasheet for absolute maximum ratings to prevent operational damage during integration.
Select this component for applications demanding high-speed digital isolation with significant noise rejection capabilities. The 5000 Vrms isolation rating makes it suitable for industrial environments with high potential differences. Consider the 15 MBd speed limit when designing for higher frequency signals. The open collector output requires appropriate pull-up resistor selection based on the target logic voltage levels and desired switching speeds.
This device belongs to the TLP2962 series of photocouplers utilizing a GaAs infrared LED and a photo IC output structure. The series is designed for high-speed logic applications where reliable signal transfer across isolated domains is critical. The TLP2962(F) specifically denotes the through-hole DIP packaging variant, distinguishing it from surface-mount alternatives within the same functional family.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout compatibility and electrical parameters against alternative high-speed optocouplers before substitution.
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