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TLP2962(TP1,F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 5KV OPEN COLLECTOR 8-SMD. Review the specifications below when checking this part for your BOM.
The TLP2962(TP1,F) is a high-speed photocoupler featuring a GaAs infrared LED and a photo IC output. It provides 5000 Vrms isolation voltage with a data rate of 15 Mb/s. The device operates within a temperature range of -40°C to +125°C. Key electrical parameters include a maximum propagation delay of 75 ns, rise time of 3 ns, and fall time of 12 ns. It supports an open collector output capable of 50 mA current and accepts a forward current of up to 20 mA. The component is housed in an SMD-8 package.
Verify the specific suffix TP1 against official Toshiba documentation to confirm reel packaging specifications and tape-and-reel dimensions. Ensure the procurement order matches the exact part number to avoid confusion with standard DIP variants or other packaging options within the TLP2962 family. Cross-reference RoHS compliance status directly with the manufacturer's latest release notes.
Select this component when high-speed digital isolation is required alongside robust noise immunity. The open-collector output simplifies interfacing with various logic families. Consider the thermal performance and power dissipation limits relative to the expected ambient operating conditions. Verify that the input current requirements align with the driving circuit capabilities.
This model belongs to the TLP2962 series of high-speed optocouplers manufactured by Toshiba Semiconductor and Storage. The series utilizes a GaAs infrared LED coupled with a photo IC to achieve fast switching speeds. The TP1 suffix typically denotes specific packaging configurations, such as reel-based surface mount delivery, distinguishing it from through-hole DIP versions.
Direct substitutes must match the 15 Mb/s data rate, 5000 Vrms isolation, and open-collector output configuration. Verify pinout compatibility and package dimensions before integration. Consult Toshiba application notes for recommended equivalent components within the same product line.
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