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TLP5702(D4-TP4,E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLTR 5KV PUSH PULL 6-SO. Review the specifications below when checking this part for your BOM.
The TLP5702(D4-TP4,E is a single-channel IGBT/MOSFET gate driver optocoupler featuring an infrared LED and integrated high-speed photodetector IC. It provides 5000 Vrms isolation voltage and supports peak output currents of 2.5 A. Key electrical parameters include a common mode transient immunity (CMTI) of 20 kV/µs, propagation delays of 200 ns for both high-to-low and low-to-high transitions, and typical rise/fall times of 15 ns and 8 ns respectively. The device operates within a temperature range of -40°C to +110°C with a maximum power dissipation of 160 mW.
Verify the specific suffix codes against official Toshiba documentation to ensure correct packaging and lead-free status. Confirm that the D4 designation aligns with required safety certifications such as UL or CSA for your target market. Cross-reference pinouts and thermal characteristics with the latest datasheet revision to avoid integration errors during PCB design.
Select this component when high-speed switching and strong noise immunity are required for isolated gate drives. The 2.5 A peak current capability suits medium-power IGBT and MOSFET applications. Ensure the system voltage does not exceed the 30 V drive side limit and verify that the 5000 Vrms isolation meets the circuit's safety requirements.
This part belongs to the TLP570x series of photocouplers designed for industrial and consumer applications. It utilizes GaAlAs infrared technology combined with silicon photodetector ICs. The SO6L package offers a compact footprint while maintaining necessary creepage and clearance distances for high-voltage isolation standards.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with alternative drivers by comparing CMTI ratings, peak output current capabilities, and package dimensions before substitution.
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