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TLP621-2XGB is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The TLP621-2XGB is a dual-channel phototransistor optocoupler manufactured by Isocom Components. It integrates an infrared emitting diode and NPN silicon phototransistors in a DIP-8 package. Key electrical parameters include a minimum current transfer ratio of 50%, a maximum forward voltage of 1.3V, and a high isolation voltage of 5300Vrms. The device supports a maximum input current of 50mA and operates within a temperature range of -30°C to +100°C.
Verify the specific suffix 'XGB' against official manufacturer documentation to confirm pinout configuration and packaging details. Ensure compatibility with existing PCB footprints and thermal management requirements. Confirm that the 5300Vrms isolation rating meets the safety standards required for the target application environment.
Select this component when high density mounting is required alongside high isolation voltage specifications. The dual-channel configuration allows for efficient use of board space compared to single-channel alternatives. Consider the 50% minimum CTR for applications requiring consistent gain across varying temperatures and operating conditions.
This part belongs to the TLP621 series of high-density mounting phototransistor optically coupled isolators. The series is designed to replace standard industry components while offering customizable electrical selections. Isocom Components manufactures these devices to meet global safety certifications including UL and VDE standards.
Typical rise time is 4μs and typical fall time is 3μs under specified test conditions.
The base TLP621 series offers surface mount options indicated by adding 'SM' to the part number, but the specific 'XGB' suffix denotes a through-hole DIP variant.
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