TLP716F(F)

Overview

The TLP716F(F) is a high-speed logic output optoisolator manufactured by Toshiba Semiconductor and Storage. It integrates a GaAs light-emitting diode with a high-speed photodetector in a 6-lead SDIP package. The device features a DC input type and provides push-pull, totem pole output characteristics. Key electrical specifications include a data rate of 15MBd, a maximum propagation delay of 75ns for both low-to-high and high-to-low transitions, and an output current capability of 10mA per channel. It offers an isolation voltage of 5000Vrms and a common-mode transient immunity (CMTI) of 10kV/µs.

Feature Summary

• High-speed signal transmission with a data rate of 15MBd
• Push-pull totem pole output configuration for robust logic interfacing
• High common-mode transient immunity of 10kV/µs
• Compact 6-lead SDIP packaging

Applications

• High-speed digital communication interfaces
• Logic circuit isolation
• Data acquisition systems requiring fast response times
• Industrial control systems with high noise environments

Procurement Notes

Verify the specific suffix (F) indicates the tape and reel or magazine packaging variant if required for automated assembly. Confirm that the 6-SDIP gull-wing package matches the PCB footprint design. Ensure the 5000Vrms isolation rating meets the safety requirements of the target application. Check for any specific handling instructions related to the high-speed photodetector components.

Selection Notes

Select this component when high-speed digital isolation is required between circuits with different ground potentials. The 15MBd data rate makes it suitable for applications where standard optocouplers are too slow. The push-pull output eliminates the need for external pull-up resistors in many logic families. Consider the 75ns propagation delay when designing timing-critical paths.

Part Context

This part belongs to Toshiba's high-speed optocoupler family, designed to replace slower relay-based or standard opto-isolated solutions in modern digital electronics. It serves as a bridge between microcontrollers and noisy industrial loads or separate power domains. The 6-lead SDIP form factor allows for easy integration into existing DIP-compatible designs while offering significantly better performance than legacy devices.

Replacement Considerations

Public confirmed substitute part numbers: None identified in provided documentation.