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The TLP716(TP,F) is a high-speed optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates an infrared emitting diode with a high-speed photodetector to provide electrical isolation. The device features a single channel configuration with DC input and push-pull, totem-pole logic output. It is designed for surface mount installation in a compact 6-lead Small Dual In-line Package (SDIP). Key electrical specifications include a maximum data rate of 15 MBd, a propagation delay of 300 ns, and an output current capability of 10 mA per channel. The unit offers a high insulation voltage rating of 5000 Vrms.
Verify the specific suffix designation when ordering, as variations such as D4 or MBS indicate different package styles or temperature ranges. Confirm the manufacturer source, as Toshiba Semiconductor and Storage has undergone corporate restructuring into TAEC Product. Ensure the component meets RoHS compliance requirements if applicable to your manufacturing standards. Check for end-of-life status or availability constraints before finalizing procurement plans.
Select this component when a small form factor is critical for board space optimization. The high-speed performance makes it suitable for applications exceeding the capabilities of standard optocouplers. Consider the 5000 Vrms isolation rating for safety-critical designs. Evaluate the 10 mA output current against the load requirements of the receiving logic circuit to ensure reliable switching without external buffering.
This device belongs to the TLP716 series of high-speed optocouplers from Toshiba. The series is characterized by its use of a high-speed photodetector to achieve fast response times. The TLP716(TP,F) variant specifically denotes the tape and reel packaging format for automated assembly. It serves as a compact alternative to larger DIP packages while maintaining high isolation performance.
Public confirmed substitute part numbers are not available in the provided documentation.