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TLP734(D4-C174,F) is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLATOR 4KV 1CH TRANS 6-DIP. Review the specifications below when checking this part for your BOM.
The TLP734(D4-C174,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It features a minimum collector-emitter breakdown voltage of 55 V and a nominal current transfer ratio of 50%. The device provides a maximum insulation voltage of 4000 Vrms. It is housed in a 6-DIP package and includes UL and VDE approvals for safety compliance.
Verify the specific suffix C174 against official Toshiba documentation to confirm exact reel specifications and tape-and-reel parameters. Ensure the component matches the required lead-free or tin-lead terminal finish as indicated in the datasheet. Confirm RoHS status, as some variants may not be compliant. Cross-reference the part number with authorized distributors to ensure authenticity and traceability.
Select this component when a single-channel transistor output is required for low-to-medium speed switching applications. The 55 V breakdown voltage suits low-voltage logic interfacing. Consider the 4000 Vrms isolation rating for safety-critical designs. Verify that the DIP package fits the available PCB footprint and that the nominal 50% current transfer ratio meets the drive requirements of the load circuit.
This part belongs to the TLP734 family of transistor output optocouplers from Toshiba. The family includes variants such as TLP733 and TLP734F, which share similar core electrical characteristics but may differ in packaging, lead finish, or specific safety certifications. The D4 suffix typically denotes a specific tape-and-reel packaging format for automated assembly.
Direct substitutes within the same family include TLP733D4 and TLP734FD4. These parts share identical electrical ratings and pin configurations. Verify that the alternative variant offers the necessary safety approvals (UL/VDE) and packaging type required for the specific application design.
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