TLP754(F)

Overview

The TLP754(F) is a high-speed photocoupler featuring an infrared LED optically coupled to an integrated photodetector IC. It operates within a supply voltage range of -0.5 V to 30 V and supports data rates up to 1 Mbps. Key electrical specifications include a maximum propagation delay of 550 ns (tpLH) and 400 ns (tpHL), with a pulse width distortion of 400 ns max. The device provides a minimum common-mode transient immunity of ±20 kV/µs and an isolation voltage of 5000 Vrms. It functions at temperatures from -40°C to 125°C, drawing a maximum supply current of 1.3 mA.

Feature Summary

• Inverter logic type with open collector output configuration
• Internal noise shield ensures high common-mode transient immunity
• Guaranteed propagation delay and pulse width distortion performance
• RoHS compliant and lead-free construction

Applications

• Intelligent Power Module signal isolation
• Motor control interface circuits
• Factory automation systems
• Industrial inverters

Procurement Notes

Verify the specific suffix designation when ordering, as it may indicate package variations or safety certification approvals such as VDE options. Confirm that the required isolation voltage ratings meet the target application's safety standards. Ensure the operating temperature range aligns with the environmental conditions of the final assembly. Cross-reference the datasheet for any specific handling precautions related to the DIP8 package.

Selection Notes

Select this component for applications requiring high-speed digital isolation between control ICs and power modules. The open-collector output simplifies interfacing with various logic families. Consider the ±20 kV/µs common-mode rejection capability for environments with rapid voltage transients. The wide operating temperature range makes it suitable for industrial and automotive-grade deployments where thermal stability is critical.

Part Context

This part belongs to Toshiba’s high-speed optocoupler family designed for robust signal transmission across isolation barriers. It integrates a GaAs infrared LED with a high-gain photodetector IC to minimize size while maximizing speed. The DIP8 package facilitates easy integration into standard PCB layouts. It serves as a reliable solution for galvanic isolation in noisy electrical environments.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.