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TLP781(D4-TELS,F) is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLATOR 5KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The TLP781(D4-TELS,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a silicon phototransistor within a four-lead plastic DIP package. The device provides high isolation voltage of 5000 Vrms minimum between input and output circuits. Key electrical parameters include a collector-emitter breakdown voltage of 80 V minimum, a maximum forward current of 25 mA, and a dark power supply of 100 nA maximum. The standard current transfer ratio is specified at 100% minimum for the GB rank.
Verify the specific suffix code against official Toshiba documentation to confirm pin pitch and lead forming specifications. Ensure the selected variant matches the required current transfer ratio rank for the intended application. Confirm compliance with relevant safety standards such as UL and VDE approvals before integration into certified designs.
Select this component when high isolation voltage and compact DIP packaging are required for single-channel signal isolation. Consider the specific CTR rank needed for the driving circuit requirements. Evaluate thermal management capabilities within the operating temperature range. Compare alternative models if surface mount or higher channel counts are necessary for the design.
This part belongs to the TLP781 series of photocouplers designed for general-purpose isolation applications. The series utilizes advanced semiconductor technology to achieve high reliability and fast response times. Variants within the family differ primarily in package dimensions and lead configurations to suit various mounting requirements.
Direct substitutes may include other Toshiba transistor output optocouplers with similar isolation ratings and package types. Cross-reference specifications for current transfer ratio and breakdown voltage to ensure functional equivalence. Verify that any replacement maintains the same safety certifications and physical footprint constraints.
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