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The TLV2302IDR is a dual-channel nano-power operational amplifier and open-drain comparator integrated circuit manufactured by Texas Instruments. It operates on a single supply voltage ranging from 2.5 V to 16 V, with split supply operation supported between ±1.25 V and ±8 V. The device consumes a typical supply current of 1.4 μA per channel. Key electrical specifications include a gain bandwidth product of 5.5 kHz, an input offset voltage maximum of 4000 μV at 25°C, and a common-mode rejection ratio up to 90 dB. The operational amplifier features rail-to-rail input and output capabilities, while the comparator utilizes an open-drain CMOS output stage.
Verify the specific ordering suffix 'R' confirms the tape-and-reel packaging format as distinct from tube packaging. Confirm the industrial temperature range specification aligns with system requirements. Ensure the SOIC-8 surface-mount package dimensions match the printed circuit board layout constraints. Validate RoHS compliance status against current manufacturing standards.
Select this component when both signal amplification and threshold detection are required in a single footprint. The low supply current makes it suitable for energy-constrained designs. Consider the open-drain nature of the comparator output, which requires an external pull-up resistor for proper logic level generation. Verify that the 5.5 kHz bandwidth meets the signal frequency requirements.
The TLV2302IDR belongs to the TLV230x family of nano-power operational amplifiers and comparators. This series integrates high DC accuracy with ultra-low power consumption. The device is designed to replace separate amplifier and comparator components, simplifying circuit design for portable electronics and industrial control applications where power efficiency is critical.
Public confirmed substitute part numbers include TLV2302ID and TLV2302IP. These variants share identical electrical characteristics but differ in packaging type, specifically SOIC-8 and PDIP-8 respectively. Verify pin compatibility and thermal dissipation ratings when substituting across different package styles.