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The TLV2304IN is a quad nano-power operational amplifier and open-drain comparator integrated circuit manufactured by Texas Instruments. It operates within a supply voltage range of 2.5 V to 16 V, with electrical characteristics specified at 2.7 V, 5 V, and 15 V. The device features rail-to-rail input and output capabilities for the amplifiers, while the comparators utilize an open-drain CMOS output stage requiring an external pull-up resistor. It provides reverse battery protection up to 18 V and supports common-mode input voltages from -0.1 V to VCC + 5 V. The unit is housed in a 14-pin Plastic DIP (N) package and is rated for industrial temperature operation from -40°C to 125°C.
Verify the specific ordering suffix 'IN' corresponds to the 14-pin Plastic DIP package when sourcing components. Confirm that the required revision matches the datasheet SLOS343 published in December 2000. Ensure compatibility with standard through-hole mounting techniques if replacing surface-mount variants. Check for any end-of-life notices or alternative package recommendations from the manufacturer before finalizing procurement plans.
Select this component when a design requires both analog signal amplification and threshold detection within a single footprint. It is appropriate for applications demanding high input impedance and minimal power drain. Consider the open-drain nature of the comparator outputs, which necessitates external pull-up resistors for proper logic level translation. Evaluate the trade-off between the low bandwidth and the extremely low power consumption for your specific signal requirements.
The TLV2304 belongs to the TLV230x family of nano-power devices, which also includes the dual-channel TLV2302. This family integrates sub-micropower operational amplifiers with open-drain comparators. The TLV2304 specifically offers four channels (two op-amps and two comparators), distinguishing it from the dual-channel variant. It shares similar electrical characteristics with other members like the TLV270x and TLV240x but differs in output stage configurations and internal architecture.
TLV2304ID: Surface-mount SOIC version of the same functional device. TLV2304IPW: TSSOP surface-mount variant. TLV2304IDR: Reel-packaged SOIC version. Verify package dimensions and pinout compatibility before substitution.