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TLV320AIC23IGQE is listed in the Codecs range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC AUDIO CODEC 32BIT SER 80BGA. Review the specifications below when checking this part for your BOM.
The TLV320AIC23IGQE is a high-performance stereo audio codec manufactured by Texas Instruments, housed in a 32-pin MicroStar Junior package. It integrates sigma-delta ADCs and DACs supporting sample rates from 8 kHz to 96 kHz with word lengths of 16, 20, 24, or 32 bits. The device features an ADC signal-to-noise ratio of up to 90 dBA and a DAC SNR of up to 100 dBA at 48 kHz sampling. Operating temperatures range from -40°C to 85°C. Power consumption is 23 mW during playback, less than 150 µW in standby, and under 15 µW when powered down.
Verify the component authenticity against official Texas Instruments documentation before integration. Confirm that the specific ordering suffix matches the required industrial temperature range and package type. Ensure design compliance with absolute maximum ratings to prevent permanent damage. Review the latest datasheet revisions for any updates to electrical characteristics or terminal assignments prior to finalizing the bill of materials.
Select this component for designs requiring a compact solution with integrated analog front-end capabilities. The MicroStar Junior package minimizes board area requirements compared to standard TSSOP options. Verify compatibility with the target system's digital interface protocols, including I2S and McBSP modes. Ensure supply voltage levels align with the specified ranges for analog, buffer, and digital core supplies.
This part belongs to the TLV320AIC23 family of stereo audio codecs designed for portable consumer electronics. It serves as a cost-effective total analog I/O solution, combining high performance with low power consumption. The device is optimized for applications where space constraints and battery life are critical design factors.
The TLV320AIC23PW is the equivalent version available in a 28-pin TSSOP package. Both variants share identical electrical specifications and functionality, differing only in physical footprint and pinout configuration.
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