SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
TLV320AIC33IGVX is listed in the Codecs range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is LOW-POWER STEREO CODEC WITH 10 I. Review the specifications below when checking this part for your BOM.
The TLV320AIC33IGVX is a low-power stereo audio CODEC designed for portable audio and telephony applications. It features a stereo audio DAC with a 100-dBA signal-to-noise ratio and a stereo audio ADC with a 92-dBA signal-to-noise ratio. The device supports data resolutions of 16, 20, 24, or 32 bits and sampling rates from 8 kHz to 96 kHz. It includes ten programmable audio input pins and seven audio output drivers, capable of driving 8-ohm speakers at 500 mW per channel. Power supplies include an analog range of 2.7 V to 3.6 V, a digital core range of 1.65 V to 1.95 V, and a digital I/O range of 1.1 V to 3.6 V. The component operates within a temperature range of -40°C to +85°C and is housed in a 5x5 mm 80-ball MicroStar Junior BGA package.
Verify the specific ordering suffix against the manufacturer's current datasheet to ensure package and temperature grade alignment. Confirm that the selected variant matches the required interface protocol and power supply specifications for the target design. Cross-reference the part number with official Texas Instruments documentation to validate availability and compliance status before finalizing procurement plans.
Select this component when a single-chip solution for both analog-to-digital and digital-to-analog conversion is required in space-constrained designs. Ensure the system architecture supports the necessary voltage domains for analog, digital core, and I/O supplies. Evaluate the need for integrated headphone and speaker drivers to determine if external amplification can be omitted, thereby reducing bill of materials and board area.
This part belongs to the TLV320AIC33 series of low-power stereo audio CODECs from Texas Instruments. The IGVX suffix specifically denotes the 5x5 mm 80-ball MicroStar Junior BGA package variant. Other variants in the family include QFN packages and different thermal grades, offering flexibility for various PCB layout constraints and thermal management requirements in portable electronic devices.
Direct replacements within the same family include other package options of the TLV320AIC33, such as the QFN versions. Verify pin compatibility and electrical characteristics when substituting with different package types. No cross-family replacements are confirmed in the provided documentation.
Explore related parts through Interface, Integrated Circuits (ICs), all product categories, ChipApex homepage.