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TLV320DAC26IRHBRG4 is listed in the ADCs/DACs - Special Purpose range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 24BIT 96K 32VQFN. Review the specifications below when checking this part for your BOM.
The TLV320DAC26IRHBRG4 is a stereo audio DAC manufactured by Texas Instruments, housed in a 32-pin VQFN package. It supports digital audio resolutions of 16, 20, 24, and 32 bits with a maximum sampling rate of 53 kHz. The device delivers a typical signal-to-noise ratio (SNR) of 97 dBA for headphone outputs and 102 dBA for speaker outputs. Operating voltage ranges from 2.7 V to 3.6 V for analog supplies and 1.525 V to 1.95 V for the digital core. It integrates on-chip power amplifiers capable of driving an 8-ohm speaker at up to 325 mW or 16-ohm headphones at over 30 mW per channel.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status as indicated in official documentation. Ensure proper ESD handling protocols are followed during storage and assembly due to the sensitivity of precision integrated circuits.
Select this component for portable applications requiring low-power stereo playback with integrated output drivers. Ensure the system design accommodates the specific supply voltage requirements: 2.7 V to 3.6 V for AVDD/DRVDD and 1.525 V to 1.95 V for DVDD. Verify that the host processor supports the required SPI control interface and compatible serial audio data formats.
This part belongs to the TLV320DAC26 series of high-quality, low-power audio DACs. The 'G4' suffix denotes lead-free packaging compliant with specific environmental standards. It is designed to replace older audio codec solutions by integrating both DAC and output amplification stages into a single compact QFN package.
The non-G4 version TLV320DAC26IRHBR is a direct functional substitute within the same family. When replacing, verify that the PCB footprint matches the 32-VQFN (5x5 mm) package dimensions and that thermal pad connections are maintained for optimal heat dissipation.
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