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TLV3401CDBVR is listed in the Comparators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC COMPARATOR 1 GEN PUR SOT23-5. Review the specifications below when checking this part for your BOM.
The TLV3401CDBVR is a single-channel nanopower analog comparator manufactured by Texas Instruments. It features an open-drain output and operates within a supply voltage range of 2.5 V to 16 V. The device draws a typical operating current of 950 nA, ensuring minimal power consumption in battery-operated applications. It offers a maximum input offset voltage of 4.4 mV and a propagation delay of 175 µs. Designed for general-purpose use, it supports rail-to-rail inputs and functions reliably across an extended temperature range from 0°C to 70°C in the SOIC-8 package.
Verify the specific suffix CDBVR confirms the commercial temperature grade and SOIC-8 surface-mount packaging. Confirm RoHS compliance status through the official manufacturer datasheet before integration. Ensure design compatibility with the open-drain output requirements and pull-up resistor selection for the target logic levels.
Select this component when ultra-low quiescent current is critical compared to standard comparators. Consider the 175 µs propagation delay as a limiting factor for high-speed switching applications. Evaluate the 4.4 mV max offset voltage against required accuracy thresholds. Verify that the commercial temperature range meets the environmental constraints of the final assembly.
The TLV3401CDBVR belongs to the TLV340x family of nanopower comparators from Texas Instruments. This series emphasizes energy efficiency for always-on applications. The device complements other linear ICs in the portfolio by providing precise threshold detection with minimal power impact. It serves as a fundamental building block for low-energy signal conditioning stages.
Official substitutes include TLV3401CD and TLV3401CDBVTG4 within the same family. Verify pinout compatibility and electrical parameter equivalence before substitution. Cross-reference thermal grades and package dimensions to ensure mechanical fit without redesigning the PCB layout.
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