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TLV5608IDW is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 10BIT V-OUT 20SOIC. Review the specifications below when checking this part for your BOM.
The TLV5608IDW is a low-power, 10-bit, eight-channel serial digital-to-analog converter manufactured by Texas Instruments. It operates on a single analog and digital power supply ranging from 2.7 V to 5.5 V. The device features a resistor-string architecture with a settling time of 3 µs and a sampling rate of 283 kS/s. It supports DSP, Microwire, QSPI, and SPI interfaces within a 20-pin SOIC package. Key performance metrics include a differential nonlinearity of ±0.1 LSB, integral nonlinearity of ±0.5 LSB, and a gain error of 0.6% FSR. Power consumption is rated at 18 mW, and it functions across an industrial temperature range of -40°C to +85°C.
Verify the specific suffix against official manufacturer documentation to confirm package type and temperature grade. Ensure the ordering code matches the required pin configuration and RoHS compliance status. Cross-reference the datasheet revision date to validate parameter accuracy before integration into design specifications.
Select this component when eight simultaneous 10-bit voltage outputs are required in a space-constrained design. Verify that the system clock frequency aligns with the specified 283 kS/s sampling rate. Confirm that the load capacitance connected to each channel does not exceed the drive capability limits defined in the electrical characteristics table.
This part belongs to the TLV5608 series of low-power DACs. It shares core functional specifications with variants such as the TLV5608IPW, which utilizes a TSSOP-20 package instead of the SOIC-20 form factor. Both variants maintain identical electrical performance and pinout compatibility within their respective package constraints.
The TLV5608IPW serves as a direct package alternative offering identical electrical specifications in a TSSOP-20 footprint. Designers must verify board layout compatibility when substituting between SOIC and TSSOP packages.
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