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TLV5614IYE is listed in the Digital To Analog Converters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DAC 12BIT V-OUT 16WCSP. Review the specifications below when checking this part for your BOM.
The TLV5614IYE is a quadruple 12-bit voltage output digital-to-analog converter (DAC) featuring a flexible 4-wire serial interface. It operates on dual independent supplies ranging from 2.7 V to 5.5 V, supporting both separate and tied configurations for digital and analog domains. The device integrates high-impedance reference buffers for REFINAB and REFINCD, allowing distinct reference voltages for different DAC pairs. Output settling time is programmable via control bits in the 16-bit serial word, offering typical values of 3 µs or 9 µs. It includes hardware and software power-down modes with 10 nA current consumption.
Verify that the specific ordering suffix 'IYE' corresponds to the Wafer Chip Scale Package (WCSP). Note that while the die is qualified using wire-bonded SOIC packaging, the WCS package qualification including board level reliability is the customer's responsibility. Confirm underfill usage during assembly to mitigate thermal mismatch failures and ensure compliance with recommended peak reflow temperatures.
Select this component when a quad-channel 12-bit DAC with low power consumption is required. Ensure the application can accommodate the WCSP package constraints, specifically regarding board-level reliability testing and mandatory underfill application. Verify that the serial interface timing meets the setup and hold requirements for the host microcontroller or DSP.
The TLV5614IYE utilizes the same silicon die as the TLV5614ID but employs a wafer chip-scale package (WCSP). Unlike the standard SOIC version, the IYE variant requires customer-led qualification for board-level reliability. It belongs to the TLV5614 family of low-power, quad-channel DACs designed for battery-operated and industrial environments.
TLV5614ID: Uses the same die in a wire-bonded small outline (SOIC) package with full manufacturer qualification.
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