Instrumentation, Op Amps, Buffer Amps TLV6002QDRQ1 product image

TLV6002QDRQ1

$0.70
  • Description:IC OPAMP GP 2 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:338d842d4ac7 Category: Brand:

  
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TLV6002QDRQ1 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for TLV6002QDRQ1

  • Description:IC OPAMP GP 2 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Amplifier Type:General Purpose
  • Number of Circuits:2
  • Output Type:Rail-to-Rail
  • Slew Rate:0.5V/µs
  • Gain Bandwidth Product:1 MHz
  • Current - Input Bias:1 pA
  • Voltage - Input Offset:750 µV
  • Current - Supply:75µA (x2 Channels)
  • Current - Output / Channel:15 mA
  • Voltage - Supply Span (Min):1.8 V
  • Voltage - Supply Span (Max):5.5 V
  • Operating Temperature:-40°C ~ 125°C
  • Grade:Automotive
  • Qualification:AEC-Q100
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOIC
  • -3db Bandwidth:-

Instrumentation, Op Amps, Buffer Amps datasheet and documents for TLV6002QDRQ1

TLV6002QDRQ1

Instrumentation, Op Amps, Buffer Amps Overview

The TLV6002QDRQ1 is an automotive-grade, dual-channel operational amplifier from Texas Instruments. It operates on a supply voltage range of 1.8 V to 5.5 V with a gain-bandwidth product of 1 MHz and a slew rate of 500 mV/us. Key electrical parameters include a maximum input offset voltage of 4.5 mV, input bias current of 1 pA, and quiescent current of 75 uA per channel. The device provides 15 mA output drive capability and features rail-to-rail input and output. It is housed in an 8-SOIC package and supports operating temperatures from -40°C to +125°C.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • Automotive qualification compliant with AEC-Q100 standards for reliability in vehicle environments.
  • Rail-to-rail input and output stages maximize dynamic signal range across the supply voltage.
  • Low power consumption design suitable for battery-operated or energy-efficient systems.

Instrumentation, Op Amps, Buffer Amps Applications

  • Sensor signal conditioning in automotive chassis and body electronics
  • Battery management system monitoring circuits
  • General-purpose analog signal processing in cost-sensitive automotive modules

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm package type and tape-and-reel specifications. Ensure the component meets the required AEC-Q100 grade for your target application. Cross-reference the part number with authorized distributors to confirm authenticity and traceability documentation availability prior to procurement.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when a dual-channel amplifier with low power consumption and rail-to-rail performance is required for automotive applications. Consider the 1 MHz bandwidth and 15 mA drive current for moderate-speed signal processing tasks. Evaluate the 4.5 mV offset voltage specification against the precision requirements of the target sensor interface circuit.

Instrumentation, Op Amps, Buffer Amps Part Context

This device belongs to the TLV600x-Q1 family of low-power operational amplifiers designed specifically for automotive use. It shares architectural similarities with single-channel variants like the TLV6001QDCKRQ1 but offers dual channels in an 8-pin SOIC package. The series targets cost-sensitive applications requiring robust performance under varying temperature conditions typical of automotive environments.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

The TLV6002QDGKRQ1 serves as a pin-compatible alternative featuring an 8-VSSOP package instead of the standard SOIC-8 form factor. Engineers must verify footprint compatibility during PCB layout adjustments when substituting between these package types.

TLV6002QDRQ1TLV6002QDRQ1
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