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TLV6002QDRQ1 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The TLV6002QDRQ1 is an automotive-grade, dual-channel operational amplifier from Texas Instruments. It operates on a supply voltage range of 1.8 V to 5.5 V with a gain-bandwidth product of 1 MHz and a slew rate of 500 mV/us. Key electrical parameters include a maximum input offset voltage of 4.5 mV, input bias current of 1 pA, and quiescent current of 75 uA per channel. The device provides 15 mA output drive capability and features rail-to-rail input and output. It is housed in an 8-SOIC package and supports operating temperatures from -40°C to +125°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm package type and tape-and-reel specifications. Ensure the component meets the required AEC-Q100 grade for your target application. Cross-reference the part number with authorized distributors to confirm authenticity and traceability documentation availability prior to procurement.
Select this component when a dual-channel amplifier with low power consumption and rail-to-rail performance is required for automotive applications. Consider the 1 MHz bandwidth and 15 mA drive current for moderate-speed signal processing tasks. Evaluate the 4.5 mV offset voltage specification against the precision requirements of the target sensor interface circuit.
This device belongs to the TLV600x-Q1 family of low-power operational amplifiers designed specifically for automotive use. It shares architectural similarities with single-channel variants like the TLV6001QDCKRQ1 but offers dual channels in an 8-pin SOIC package. The series targets cost-sensitive applications requiring robust performance under varying temperature conditions typical of automotive environments.
The TLV6002QDGKRQ1 serves as a pin-compatible alternative featuring an 8-VSSOP package instead of the standard SOIC-8 form factor. Engineers must verify footprint compatibility during PCB layout adjustments when substituting between these package types.
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