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TMDS351PAG is listed in the Specialized range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INTERFACE SPECIALIZED 64TQFP. Review the specifications below when checking this part for your BOM.
The TMDS351PAG is a high-performance HDMI switch IC manufactured by Texas Instruments. It supports the transmission of uncompressed digital audio and video data compliant with the HDMI specification. The device features a 2-to-1 configuration, allowing two HDMI sources to be selected for output to a single display. It operates at a supply voltage of 3.3 V and is housed in a TQFP-64 package. Key electrical parameters include a maximum on-resistance of 40 ohms, a maximum propagation delay of 250 ns, and a maximum blanking time of 15 ns. The component is rated for operation within a temperature range of 0°C to +70°C.
Verify the specific suffix 'PAG' against the manufacturer's official datasheet to confirm pinout and package dimensions. Confirm RoHS compliance status through the current product lifecycle notification. Check for obsolescence notices as this component family may have limited availability or end-of-life status depending on the manufacturing date code.
Select this component when a compact solution for routing two HDMI inputs to one output is required. Ensure the design accommodates the 3.3 V supply voltage and TQFP-64 thermal requirements. Verify that the 40 ohm on-resistance meets the signal integrity needs of the specific HDMI cable length and display resolution.
The TMDS351 belongs to the TMDS series of video switch ICs designed for HDMI applications. It is part of Texas Instruments' portfolio of display interface solutions. This specific model focuses on providing reliable switching for digital multimedia interfaces while maintaining signal quality across the HDMI bandwidth.
Consult the TI HDMI switch product migration guide for direct replacements. Potential alternatives include other models within the TMDS series that offer similar 2-to-1 configurations and TQFP-64 packaging. Verify compatibility with existing PCB footprints and control logic before substitution.
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