TMS-140-55-L-D

Headers, Male Pins Overview

The TMS-140-55-L-D is a micro header from the Samtec TMS series, designed for board-to-board interconnections. It features a 1.27 mm (0.050 inch) contact pitch and a 2.54 mm (0.100 inch) row spacing. The connector supports up to 100 positions in a dual-row configuration with male pin contacts. It utilizes a through-hole termination method and offers vertical or right-angle mounting orientations. The housing is constructed from liquid crystal polymer (LCP) with a black color and UL94 V-0 flammability rating. Contact materials consist of phosphor bronze with gold plating on the mating surfaces.

Headers, Male Pins Feature Summary

• Supports single or double row designs with up to 100 pins
• Utilizes .018 inch square post contact system
• Provides flexible PCB design options with vertical or right-angle orientations

Headers, Male Pins Applications

• Board-to-board interconnections
• High-density electronic assemblies
• Industrial control systems

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official Samtec documentation to confirm exact pin count, orientation, and plating specifications. Ensure compatibility with mating connectors such as RSM or SLM series sockets. Confirm RoHS compliance status and moisture sensitivity level requirements for your assembly process before procurement.

Headers, Male Pins Selection Notes

Select this component when a high-density connection with 1.27 mm pitch is required. Consider the dual-row layout for increased I/O density within limited board space. Evaluate the mechanical stability needs to determine if vertical or right-angle mounting best suits the enclosure constraints. Verify that the phosphor bronze contact material meets the electrical performance requirements.

Headers, Male Pins Part Context

This part belongs to the TMS family of micro headers, which are characterized by their compact form factor and reliable through-hole construction. The series provides designers with flexibility in routing and stacking applications. It serves as a standard solution for connecting daughter boards to motherboards in various electronic devices requiring robust signal transmission.

Headers, Male Pins Replacement Considerations

Check for direct substitutes within the TMS series with different pin counts or orientations. Verify cross-compatibility with mating socket series like RSM or SMS. Ensure any replacement maintains the same pitch, current rating, and environmental specifications.