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TMS320DM6467CZUT7 is listed in the Digital Signal Processor Dsp range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DIGITAL MEDIA SOC 529FCBGA. Review the specifications below when checking this part for your BOM.
The TMS320DM6467CZUT7 is a Digital Media System-on-Chip (DMSoC) from Texas Instruments, featuring a dual-core architecture with a C64x+ DSP and an ARM926EJ-S processor. It operates at clock rates up to 729 MHz for the DSP and 364.5 MHz for the ARM core. The device includes 248 KB of on-chip RAM, 8 KB of ROM, and supports USB 2.0 High-/Full-Speed Client mode. It utilizes a 529-pin FCBGA package with a 0.8-mm ball pitch.
Verify the specific suffix 'CZUT7' against current TI documentation, as the datasheet notes that ZUT packages are classified as end-of-life and replaced by CUT packages. Confirm availability status and lead times directly with Texas Instruments or authorized distributors, as production data may vary.
Select this component for applications requiring high-performance fixed-point DSP processing combined with RISC control. Ensure the design accommodates the 529-pin FCBGA package requirements. Verify power supply constraints, specifically the 1.2 V core voltage and 1.8 V/3.3 V I/O levels, and confirm compatibility with required operating temperature ranges.
This part belongs to the TMS320DM646x series within the DaVinci technology family. It is designed to meet digital media processing needs by integrating mixed processor technologies. The device leverages the C6000 DSP platform for numerical capability and ARM9 for system control.
The datasheet indicates that ZUT orderables are replaced by CUT orderables due to end-of-life status. Check for direct pin-compatible CUT variants in the same family if ZUT units are unavailable.
The C64x+ DSP core can operate at a maximum clock rate of 729 MHz.
No, the CUT suffix indicates support for USB 2.0 High-/Full-Speed Client mode only. Host mode requires a different suffix variant.
It uses a 529-pin Flip Chip Ball Grid Array (FCBGA) package with dimensions of 19 mm x 19 mm and a 0.8 mm ball pitch.
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