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The TMUX6219DGKR is a single-channel, 2:1 (SPDT) CMOS analog switch manufactured by Texas Instruments. It operates with a single supply voltage ranging from 4.5 V to 36 V, or dual supplies of ±4.5 V to ±18 V. The device supports bidirectional analog and digital signals on the source (SX) and drain (D) pins within the VSS to VDD range. Key electrical parameters include a maximum on-resistance of 2.9 Ohms, a typical bandwidth of 40 MHz, and a maximum propagation delay of 920 ps. Switching times are specified at a maximum of 170 ns for turn-on and 180 ns for turn-off. The component is housed in an 8-pin VSSOP package and functions reliably across an operating temperature range of -40°C to +125°C.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging and tape-and-reel specifications. Confirm that the component meets RoHS compliance requirements for your target market. Cross-reference the datasheet revision date to ensure alignment with current manufacturing standards and parameter updates before finalizing procurement orders.
Select this component when a single SPDT switch with high voltage tolerance and low on-resistance is required. Ensure the application signal range falls within the VSS to VDD limits. Consider the VSSOP-8 package size for space-constrained designs. Verify that the switching speed and leakage characteristics meet the system's performance criteria compared to alternative series members.
This part belongs to the TMUX6219 family of high-voltage, low-Ron analog switches. It shares core functionality with variants like the TMUX6219RQXR but differs in package type and automotive qualification status. The DGKR suffix indicates a specific tape-and-reel packaging configuration suitable for automated surface-mount assembly processes.
The TMUX6219RQXR is a verified equivalent within the same family, offering identical electrical specifications. Note that the RQXR variant carries automotive qualification, whereas the DGKR may not. Ensure pin compatibility and package dimensions match the existing PCB layout before substitution.