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Product Detailed Parameters
- Description：MICROPHONE
- Series：-
- Mfr：Knowles
- Package：Tray
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Overview
The TO38-31548-B20 is a subminiature electret condenser microphone manufactured by Knowles. It is designed for high-performance audio capture in space-constrained and rugged environments. The component utilizes an electret capsule to convert acoustic signals into electrical outputs, suitable for applications requiring compact form factors and reliable sound reproduction.
Feature Summary
- Subminiature physical design optimized for tight spatial constraints
- Electret condenser technology for consistent audio signal conversion
- Engineered for operation in rugged environmental conditions
Applications
- Portable electronic devices with limited internal volume
- Ruggedized communication equipment
- Compact audio recording systems
Procurement Notes
Verify the specific revision suffix against the manufacturer's current documentation to ensure compatibility with intended acoustic specifications. Confirm RoHS compliance status through official datasheets prior to integration. Validate pinout configurations against the latest assembly drawings to prevent interface mismatches during PCB layout and manufacturing processes.
Selection Notes
Select this component when miniaturization is critical alongside standard electret performance characteristics. Evaluate mechanical mounting requirements against the subminiature package dimensions. Ensure the target application environment aligns with the specified ruggedness ratings for long-term reliability in demanding operational scenarios.
Part Context
This model belongs to Knowles' line of subminiature electret microphones. These components are part of a broader family designed to replace larger traditional microphones in modern portable electronics. The series emphasizes size reduction while maintaining functional integrity for professional and consumer audio applications.
Replacement Considerations
Consult official substitution guides for compatible equivalents within the same product family. Verify that any alternative maintains identical acoustic sensitivity and frequency response curves. Ensure mechanical footprint compatibility to avoid redesigning existing enclosures or printed circuit boards.
