TOLC-140-02-S-Q-A-TR

Headers, Male Pins Overview

The TOLC-140-02-S-Q-A-TR is a .050" (1.27 mm) pitch quad row surface mount terminal strip designed for board-to-board and mezzanine applications. This male header features 160 total positions arranged in four rows of 40 contacts each. The connector utilizes phosphor bronze terminals with a selective gold plating specification, indicated by the 'S' suffix, providing a 30 µin (0.76 µm) gold thickness over a nickel barrier at contact areas. It supports a stacking height of 6.35 mm, defined by the '02' lead style code. The unit includes alignment pins ('A') to assist in PCB assembly positioning.

Headers, Male Pins Feature Summary

• Quad row layout maximizes I/O density within a compact footprint
• Selective gold plating ensures reliable signal integrity
• Integrated alignment pins facilitate precise board assembly

Headers, Male Pins Applications

• High-density board-to-board interconnects
• Mezzanine circuit board connections
• Space-constrained electronic assemblies

Headers, Male Pins Procurement Notes

Verify the specific plating requirement matches the application needs, as this model uses selective gold rather than full coverage. Confirm that the 6.35 mm stacking height aligns with the mechanical design constraints. Ensure the mating SOLC socket is selected from the compatible series. Check for RoHS compliance status if required by the manufacturing process. Validate that the alignment pin configuration does not conflict with surrounding components on the PCB.

Headers, Male Pins Selection Notes

Select this component when high pin count is required in a limited area. The quad row design offers superior space efficiency compared to single or dual-row alternatives. Choose the selective gold option for cost-effective reliability in standard environments. Consider the 6.35 mm height for low-profile stack-ups. Verify mating compatibility with Tiger Buy™ sockets for optimal retention force.

Headers, Male Pins Part Context

This part belongs to Samtec's TOLC series, which specializes in high-density interconnect solutions. The series is characterized by its staggered pin arrangement, allowing up to 200 I/Os in under one square inch. It is engineered for applications demanding robust connectivity in tight spaces, such as automotive and data center systems. The TOLC series mates specifically with SOLC sockets.

Headers, Male Pins Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Generic equivalents may exist but require rigorous validation against electrical and mechanical specifications.