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TOP256PG is listed in the AC DC Converters, Offline Switchers range at ChipApex. The manufacturer field lists Power Integrations. Its product description is IC OFFLINE SWITCH FLYBACK 8DIP. Review the specifications below when checking this part for your BOM.
The TOP256PG is an integrated offline switch from the TOPSwitch-HX family, manufactured by Power Integrations. It combines a 700 V power MOSFET, high-voltage switching current source, PWM controller, oscillator, thermal shutdown circuit, and fault protection on a single monolithic chip. The device utilizes DIP-8 packaging for through-hole mounting. Key electrical parameters include a rated output power of 34 W, a maximum duty cycle of 78%, and a fixed switching frequency of 66 kHz. It operates within a temperature range of -40 °C to 150 °C.
Verify the specific suffix 'P' confirms the DIP-8 package variant when sourcing. Confirm RoHS compliance status as required by regional regulations. Ensure the supplier provides official datasheets matching the TOP256PG designation to avoid confusion with similar eSIP or TO-220 variants. Validate that the component is marked as active in the manufacturer's current portfolio.
Select this component for designs requiring a cost-effective, high-reliability flyback converter solution up to 34 W. The fixed 66 kHz frequency simplifies transformer design compared to variable frequency options. The DIP-8 package facilitates manual assembly or standard through-hole wave soldering processes. Consider thermal management requirements given the 34 W power rating in the specified package.
This part belongs to the TOPSwitch-HX series, which represents an evolution of the popular TOPSwitch family. The HX series introduces enhanced features such as improved EMI performance through frequency jittering and higher integration levels. It is designed to replace discrete solutions, reducing bill-of-materials count and PCB area while maintaining high efficiency across various load conditions.
TOP256PN (DIP-8), TOP256GN (SMD-8C). Verify pinout compatibility and thermal characteristics before substitution.
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