TPA0212PWP

Overview

The TPA0212PWP is a stereo Class-AB audio power amplifier in a 24-pin thermally enhanced PowerPAD TSSOP package. It delivers 2.6 W per channel into 3-ohm loads and operates on a single 5 V supply. The device features four selectable BTL gain settings (2, 6, 12, and 24 V/V) controlled by GAIN0 and GAIN1 pins, with fixed 1 V/V gain for SE headphone mode. It includes an internal input MUX for line or headphone sources, PC-Beep support, and depop circuitry to eliminate startup transients.

Feature Summary

• Integrated input multiplexer allows selection between dedicated line and headphone inputs via the HP/LINE control terminal.
• Internal gain configuration eliminates external resistors, providing four distinct bridge-tied load gain levels.
• Built-in depop circuitry prevents audible transients during power-up and shutdown sequences.
• Thermally enhanced PowerPAD package enables high power dissipation in a low-profile surface-mount form factor.

Applications

• PC99 compliant desktop computer line-out stages
• Notebook computer internal speaker amplification
• Headphone driver circuits requiring low distortion

Procurement Notes

Verify the specific suffix 'R' if tape-and-reel packaging is required, as the base part number denotes tube packaging. Confirm that the PWP package thermal pad is properly soldered to the PCB ground plane to achieve specified thermal impedance. Ensure the design accommodates the -40°C to +85°C operating temperature range.

Selection Notes

Select this component for designs requiring integrated gain control and input switching without external discrete components. The device is suitable for single-supply applications where board space is limited. Consider the input impedance variation across gain settings when designing the input coupling network to maintain consistent frequency response.

Part Context

This device belongs to Texas Instruments' TPA0212 series of stereo audio power amplifiers. It is designed specifically for portable and desktop audio systems where low power consumption and minimal external component count are critical. The PowerPAD technology distinguishes it from standard TSSOP packages by offering superior heat transfer capabilities.

Replacement Considerations

TPA0212PWPR