TPA2051D3YFFR

Overview

The TPA2051D3YFFR is a Class-D audio amplifier subsystem manufactured by Texas Instruments. It features a single channel with differential or single-ended input options and supports both differential and single-ended output configurations. The device operates within a supply voltage range of 2.5 V to 5.5 V and delivers up to 25 W of output power into a 4-ohm load. Total Harmonic Distortion plus Noise (THD+N) is specified at 0.04% and 0.01%. It functions in temperatures from -40°C to +85°C, draws 7.1 mA of quiescent current, and is housed in a DSBGA-25 package.

Feature Summary

• Integrates a complete audio subsystem with Class-D amplification technology for high efficiency.
• Supports flexible input configurations including both differential and single-ended signal sources.
• Provides versatile output topology supporting differential or single-ended speaker connections.

Applications

• Portable multimedia devices requiring high-power audio output
• Desktop speakers and soundbars
• Home theater systems

Procurement Notes

Verify the specific suffix YFFR against the manufacturer's official datasheet to confirm the reel packaging quantity and tape specifications. Ensure the component matches the required DSBGA-25 footprint and pinout for your PCB design. Cross-reference the RoHS status and lead-free compliance details directly with the supplier's certification documents prior to ordering.

Selection Notes

Select this component when a single-channel solution capable of delivering high power into low-impedance loads is required. The wide supply voltage range accommodates various battery-powered and mains-powered designs. Consider the thermal performance and heat dissipation requirements associated with 25 W output when designing the enclosure and PCB layout.

Part Context

This part belongs to the TPA2051D3 series of audio subsystems from Texas Instruments. It is designed to replace older discrete amplifier solutions by integrating control logic and protection circuits. The DSBGA-25 package allows for compact board space utilization compared to larger SOIC or QFN packages found in lower-power variants.

Replacement Considerations

Check for direct pin-to-pin replacements within the same family, such as the TPA2051D3YFFT, which differs primarily in packaging format. Verify that any substitute maintains the same 25 W power rating and DSBGA-25 footprint compatibility.