TPA311DGN

TPA311DGN

$1.43
  • Description:IC AMP CLASS AB MONO 700MW 8MSOP
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tube

SKU:abe74b71f871 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC AMP CLASS AB MONO 700MW 8MSOP
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tube
  • Type:Class AB
  • Output Type:1-Channel (Mono)
  • Max Output Power x Channels @ Load:700mW x 1 @ 8Ohm
  • Voltage - Supply:2.5V ~ 5.5V
  • Features:Depop, Short-Circuit and Thermal Protection, Shutdown
  • Mounting Type:Surface Mount
  • Supplier Device Package:8-HVSSOP
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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TPA311DGN

Overview

The TPA311DGNR is a mono audio power amplifier in an 8-pin PowerPAD MSOP package. It operates on a single supply voltage ranging from 2.5 V to 5.5 V. The device supports both bridge-tied load (BTL) and single-ended (SE) output configurations. In BTL mode, it delivers up to 700 mW into an 8-ohm load at 5 V. Key electrical parameters include a unity-gain bandwidth of 1.4 MHz and a shutdown supply current as low as 60 µA at 5 V.

Feature Summary

  • Switchable between bridge-tied load and single-ended modes for flexible speaker or earphone driving
  • Integrated depop circuitry to minimize audible noise during power-up and shutdown transitions
  • Built-in thermal overload and short-circuit protection mechanisms

Applications

  • Low-voltage portable electronic devices
  • Internal speaker amplification systems
  • External earphone drive circuits

Procurement Notes

Verify the specific ordering suffix 'R' indicates tape-and-reel packaging when sourcing components. Confirm that the DGN designation corresponds to the PowerPAD MSOP package variant rather than standard SOIC. Ensure compatibility with the required PCB layout for thermal dissipation associated with this specific package type.

Selection Notes

Select this component for applications requiring minimal external coupling capacitors due to the BTL configuration. Consider the PowerPAD MSOP package for significant reductions in board space and profile compared to traditional surface-mount options. Evaluate the trade-off between output power capabilities in BTL versus SE modes based on the specific load impedance requirements.

Part Context

This part belongs to the TPA311 series of audio amplifiers designed specifically for battery-powered equipment. The series includes variants such as the TPA311D in an SOIC package. The TPA311DGNR represents the surface-mount PowerPAD MSOP version optimized for compact designs.

Replacement Considerations

TPA311DG

TPA311DGNTPA311DGN
$1.43
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