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TPA4411MRTJR is listed in the Audio Amplifiers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC AMP CLASS AB STER 100MW 20QFN. Review the specifications below when checking this part for your BOM.
The TPA4411MRTJR is a stereo Class-AB audio amplifier manufactured by Texas Instruments, designed for single-supply operation. It features a DirectPath architecture that eliminates output coupling capacitors, enabling cap-free headphone driving. The device operates within a supply voltage range of 1.8 V to 4.5 V and delivers up to 80 mW of output power into a 16 Ohm load. Key electrical specifications include a gain of 63.52 dB, a THD+N of 0.054%, and a quiescent current of 8 mA. It is housed in a 20-WFQFN (4x4) package with an exposed pad.
Verify the specific suffix 'JR' against the manufacturer's latest datasheet to confirm pinout compatibility and RoHS status. Ensure the procurement channel provides traceable documentation for the 20-QFN package variant. Cross-reference the part number with official Texas Instruments databases to validate current production status and avoid obsolete stock.
Select this component when a low-power, high-fidelity solution is required for driving low-impedance loads directly without external blocking capacitors. It is suitable for applications constrained by tight PCB real estate and limited supply voltage rails. Consider the 20-pin QFN footprint for thermal management requirements and surface-mount assembly processes.
This part belongs to the TPA4411 series of audio amplifiers from Texas Instruments. The series is characterized by its ability to drive headphones directly from a single battery source. The TPA4411MRTJR specifically denotes the reel-packaged version of the amplifier in the 20-WFQFN form factor, intended for automated surface-mount manufacturing.
The TPA4411RTJG4 is a documented lead-free variant within the same family. Verify pin-to-pin compatibility and functional equivalence before substitution. Other members of the TPA4411 series may offer different packaging options but share similar core architectures.
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