SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TPA741DGN is a mono, differential input, Class-AB audio power amplifier from Texas Instruments. It operates within a supply voltage range of 2.5V to 5.5V, supporting typical 3.3V and 5V configurations. The device delivers up to 700mW into an 8Ω load at 5V and 250mW at 3.3V. Key electrical parameters include a Power Supply Rejection Ratio (PSRR) of 85dB at 3.3V and 78dB at 5V. Total Harmonic Distortion plus Noise (THD+N) remains below 0.5% at 250mW output in the 200Hz–4kHz range when powered by 5V. It features active high shutdown and depop circuits.
Verify the specific suffix 'DGN' corresponds to the 8-pin MSOP-PowerPAD package with an operating temperature range of -40°C to 85°C. Confirm that the component matches the official Texas Instruments datasheet specifications for the TPA741 family. Ensure authenticity through authorized distribution channels to guarantee performance integrity and compliance with stated electrical characteristics.
Select this component for applications requiring differential inputs and high efficiency in small packages. The MSOP-PowerPAD package reduces PCB area significantly compared to standard SOIC versions. Consider the BTL architecture for maximizing output power within limited supply voltage constraints. Evaluate thermal management requirements based on the specific power dissipation expected in the target application environment.
The TPA741DGN belongs to the TPA741 series of low-voltage audio amplifiers. It shares functional similarities with other members like TPA741D and TPA741DGNG4, differing primarily in packaging and reel options. The DGN variant specifically denotes the surface-mount MSOP-PowerPAD package, optimized for space-constrained portable designs while maintaining robust thermal performance.
TPA741DGNG4 serves as a direct equivalent with identical electrical specifications and pinout. TPA741DGNR offers the same functionality in a tape-and-reel format suitable for automated assembly processes. Verify package dimensions and thermal pad connectivity when substituting between these variants.