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Product Detailed Parameters
- Description：IC AMP CLASS AB MONO 700MW 8MSOP
- Series：-
- Mfr：Texas Instruments
- Package：Tape & Reel (TR),Cut Tape (CT),Bulk
- Type：Class AB
- Output Type：1-Channel (Mono)
- Max Output Power x Channels @ Load：700mW x 1 @ 8Ohm
- Voltage - Supply：2.5V ~ 5.5V
- Features：Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
- Mounting Type：Surface Mount
- Supplier Device Package：8-HVSSOP
- Package / Case：8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Operating Temperature：-40°C ~ 85°C (TA)
- Grade：-
- Qualification：-
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Overview
The TPA751DGNR is a Texas Instruments mono Class-AB audio power amplifier in an 8-pin PowerPAD MSOP package. It operates on a single supply voltage ranging from 2.5 V to 5.5 V. The device delivers up to 700 mW of output power into an 8 Ω load at 5 V and 250 mW at 3.3 V, with a total harmonic distortion plus noise of 0.55%. Key electrical parameters include a unity-gain bandwidth of 1.4 MHz, a shutdown supply current of 1.5 nA, and a typical operating supply current of 1.45 mA.
Feature Summary
- Bridge-tied load (BTL) configuration eliminates the need for external output coupling capacitors.
- Ultralow supply current in shutdown mode enables extended battery life in portable devices.
- Integrated thermal protection and short-circuit protection ensure operational reliability.
- Wide power supply compatibility supports operation across standard low-voltage ranges.
Applications
- Internal speaker amplification in mobile phones
- Audio output stages for MP3 players
- Portable gaming consoles
- Wireless communication devices
Procurement Notes
Verify the specific ordering suffix 'R' indicates tape-and-reel packaging for the DGN variant. Confirm the component matches the PowerPAD MSOP footprint requirements for thermal management. Ensure the datasheet revision aligns with design specifications before finalizing procurement orders.
Selection Notes
Select this component when a BTL topology is required to maximize output power without large coupling capacitors. The PowerPAD MSOP package offers superior thermal dissipation compared to standard SOIC variants, allowing for continuous high-power operation. Verify that the application fits within the specified 2.5 V to 5.5 V supply range.
Part Context
The TPA751DGNR belongs to the TPA751 family of low-voltage audio amplifiers. While the TPA751D uses an SOIC package with lower thermal limits, the DGN variant utilizes a PowerPAD MSOP structure for enhanced heat dissipation. This family is optimized for narrow-band applications like voice communications rather than wideband hi-fi audio.
Replacement Considerations
TPA751DGN: Identical function in standard MSOP without PowerPAD thermal pad. TPA751DR: Same function in SOIC package with tape-and-reel packaging. TPA751GQSR: BGA package alternative with similar performance characteristics.
FAQ
How does the BTL configuration affect output power compared to single-ended?
The BTL configuration doubles the voltage swing across the load, effectively quadrupling the output power delivered to the speaker compared to a single-ended ground-referenced configuration using the same supply voltage.
What is the purpose of the BYPASS terminal?
The BYPASS terminal provides access to the internal voltage divider for mid-supply bias. It should be connected to a capacitor between 0.1 µF and 2.2 µF to stabilize the internal reference voltage.
