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TPC816MD C9G is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is OPTOISOLATOR 5KV 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The TPC816MD C9G is a single-channel optocoupler manufactured by Taiwan Semiconductor Corporation. It features a phototransistor output and an infrared LED input, housed in a 4-DIP package with a 7.62mm pitch. The device provides high isolation voltage of 5000Vrms between input and output circuits. Key electrical parameters include a minimum current transfer ratio of 80% at 5mA forward current, a collector-emitter saturation voltage maximum of 200mV, and a peak forward current rating of 50mA. The unit supports through-hole mounting and operates within a temperature range of -40°C to 100°C.
Verify the specific suffix designation against official datasheets to confirm pin configuration and isolation ratings. Ensure compatibility with existing PCB footprints for 4-DIP packages. Confirm RoHS compliance status if required by project specifications. Cross-reference manufacturer part numbers to avoid substitution errors during procurement.
Select this component when high isolation voltage is required for noise immunity in industrial environments. Consider the current transfer ratio specifications for driving load requirements. Evaluate thermal management needs based on the specified operating temperature range. Verify package dimensions match mechanical constraints before finalizing design choices.
This device belongs to the TPC816 series of photocouplers from Taiwan Semiconductor. These components are designed for general-purpose signal isolation tasks. The series offers various packaging options to suit different assembly requirements. They are commonly used in applications requiring electrical separation between control and power sections.
Check for direct equivalents such as TPC816C or TPC817 variants with matching pinouts. Verify that substitute parts meet the same isolation voltage and current transfer ratio specifications. Ensure physical package dimensions are compatible with existing board layouts.
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