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The TPD3F303DQDR is a third-order RC (Pi) EMI filter with integrated ESD protection, designed for SIM card interfaces. It features three channels with resistance values of 47 ohms and 100 ohms, and capacitance of 20 pF. The device operates within a temperature range of -40°C to 85°C and utilizes an 8-WFDFN package with exposed pad dimensions of 1.70mm x 1.35mm x 0.79mm. Cut-off frequencies are specified at 294 MHz and 308 MHz.
Verify the complete part number including the suffix DQDR to ensure correct packaging and tape-and-reel configuration. Confirm RoHS compliance status and moisture sensitivity level requirements against specific manufacturing process constraints. Ensure the 8-WFDFN exposed pad footprint matches the target PCB layout design guidelines provided by Texas Instruments.
Select this component when simultaneous EMI attenuation and electrostatic discharge protection are required for high-speed data lines. The integrated VCC clamp simplifies circuit design by reducing external component count. Consider the 8-WFDFN package size for space-constrained mobile applications requiring robust signal integrity maintenance under varying thermal conditions.
This device belongs to the TPD series of ESD protection and EMI filters manufactured by Texas Instruments. It is specifically engineered for SIM card interfaces, combining passive filtering elements with active protection mechanisms. The DQDR suffix indicates the specific reel-based packaging format used for surface-mount assembly processes.
Consult official Texas Instruments documentation for verified substitute part numbers within the TPD family. Ensure any replacement maintains compatible pinout, package dimensions, and electrical specifications for SIM interface applications.