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TPS259840RZJR is listed in the Current Regulation/Management range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is ELECTRONIC FUSE. Review the specifications below when checking this part for your BOM.
The TPS259840RZJR is a stackable electronic fuse (eFuse) from Texas Instruments, designed for high-side power distribution. It operates within a supply voltage range of 4.5 V to 16 V and supports up to 70 A of continuous current. The device features a low on-resistance of 0.8 mΩ, minimizing conduction losses. It integrates an accurate and fast current monitor for precise load protection. Packaged in a 32-pin WQFN-FCRLF (5x5 mm) format, it is suitable for space-constrained applications requiring robust overcurrent and thermal protection.
Verify the specific suffix RZJ corresponds to the required tape-and-reel packaging quantity and temperature grade. Confirm that the 32-pin WQFN-FCRLF footprint matches your PCB layout guidelines. Ensure compatibility with the system's logic levels for EN/ON pin control. Cross-reference the datasheet revision date to confirm feature consistency before finalizing procurement orders.
Select this component when a 70 A capacity and 16 V maximum input are required. The stackable feature is critical if multiple eFuses must be controlled via a single line. Consider the 0.8 mΩ Ron for efficiency calculations in high-current paths. Verify that the WQFN package thermal performance meets the application's heat dissipation requirements under full load conditions.
This part belongs to the TPS25984x family of stackable eFuses. It shares core functionality with variants like TPS25984B0 but may differ in specific trim values or packaging options. The family is designed for modular power systems where uniform control and protection characteristics are essential across multiple channels.
Direct substitutes include other TPS25984x variants such as TPS25984B0RZJR, provided the electrical parameters and pinout remain compatible. Verify that any replacement maintains the stackable capability and current rating. Ensure the alternative package type fits the existing board space and thermal design constraints.
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