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TPS65680RSNT is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLTR BIDIRECTIONAL 32QFN. Review the specifications below when checking this part for your BOM.
The TPS65680RSNT is an 18-channel configurable level shifter designed for large format LCD displays. It features a pattern-programmable architecture with integrated overcurrent protection. The device supports bidirectional voltage translation across multiple channels, enabling flexible interface configurations for Gate-On-Array (GOA) and Gate Driver IC (GIP) applications. Packaged in a 32-pin WQFN (RSN) format, it operates within a temperature range of -40°C to 85°C.
Verify the specific suffix RSNT against the official Texas Instruments datasheet to confirm pinout and package dimensions. Ensure compatibility with the target PCB footprint and thermal requirements. Cross-reference the ordering part number with manufacturer documentation to avoid substitution errors due to minor suffix variations that may affect packaging or testing criteria.
Select this component when designing large format LCD drivers requiring high channel count and programmability. It is suitable for applications needing bidirectional level shifting with built-in fault protection. Consider the 32-pin WQFN package constraints and operating temperature range during layout. Evaluate if the 18-channel capacity aligns with the specific GOA or GIP topology requirements.
This part belongs to the TPS65680 family of power management and level shifters from Texas Instruments. It is specifically engineered for display driver applications, offering a specialized solution for interfacing control logic with high-voltage panel drivers. The RSN package variant provides a compact form factor suitable for space-constrained mobile and large-screen display designs.
Consult the TI datasheet for officially listed alternative packages or suffixes within the TPS65680 series. Verify functional equivalence before substituting, as pinouts and thermal characteristics may vary between package types.
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