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TPS77018DBVR is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC REG LINEAR 1.8V 50MA SOT23-5. Review the specifications below when checking this part for your BOM.
The TPS77018DBVR is a fixed-output linear low-dropout regulator manufactured by Texas Instruments. It provides a stable 1.8V output with a maximum current capacity of 50mA. The device operates within an input voltage range of 2.7V to 10V and features a typical quiescent current of 28µA. It offers a power supply rejection ratio of 60dB at 1kHz. Protection mechanisms include overcurrent, thermal shutdown, and reverse polarity protection. The component is housed in a SOT-23-5 package and supports operation across a temperature range of -40°C to 125°C.
Verify the specific suffix 'DBVR' corresponds to the tape-and-reel packaging configuration required for your assembly line. Confirm RoHS compliance status as manufacturing sites may vary. Ensure the 1.8V fixed output matches your circuit design requirements before procurement. Check for any recent product change notices regarding pinout or electrical specifications.
Select this component when a fixed 1.8V rail is needed with minimal static power draw. The 50mA output current limits suitability for high-power loads. Consider the SOT-23-5 footprint constraints during PCB layout. Evaluate the 60dB PSRR performance against the noise sensitivity of downstream components.
This part belongs to the TPS770 family of ultra-low-power LDO regulators from Texas Instruments. The series is designed for applications where power efficiency is critical. Other variants in the family offer different fixed output voltages or adjustable configurations while maintaining similar low-quiescent-current characteristics and protection features.
The TPS77018DBVRG4 is a verified equivalent variant within the same product line. Both parts share identical electrical specifications and pinouts. Verify that the G4 suffix does not introduce changes in packaging or environmental compliance relevant to your specific application needs.
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