Instrumentation, Op Amps, Buffer Amps TS27L2BIDT product image

TS27L2BIDT

$1.73
  • Description:IC CMOS 2 CIRCUIT 8SO
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:6fc0ef2838f3 Category: Brand:

  
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TS27L2BIDT is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC CMOS 2 CIRCUIT 8SO. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for TS27L2BIDT

  • Description:IC CMOS 2 CIRCUIT 8SO
  • Series:-
  • Mfr:STMicroelectronics
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Amplifier Type:CMOS
  • Number of Circuits:2
  • Output Type:-
  • Slew Rate:0.04V/µs
  • Gain Bandwidth Product:100 kHz
  • Current - Input Bias:1 pA
  • Voltage - Input Offset:250 µV
  • Current - Supply:10µA (x2 Channels)
  • Current - Output / Channel:45 mA
  • Voltage - Supply Span (Min):3 V
  • Voltage - Supply Span (Max):16 V
  • Operating Temperature:-40°C ~ 125°C
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SO
  • -3db Bandwidth:-

Instrumentation, Op Amps, Buffer Amps datasheet and documents for TS27L2BIDT

TS27L2BIDT

Instrumentation, Op Amps, Buffer Amps Overview

The TS27L2BIDT is a dual precision low-power operational amplifier manufactured by STMicroelectronics. It utilizes silicon gate CMOS technology to achieve an optimal consumption-speed ratio, making it suitable for battery-powered applications. The device operates on single or dual supplies ranging from 3V to 16V (or ±1.5V to ±8V). Key electrical characteristics include a gain-bandwidth product of 100 kHz, a slew rate of 40 mV/µs, and a supply current of 10 µA per amplifier. It features an input offset voltage of 2 mV, input bias current of 300 pA, and common-mode rejection ratio of 65 dB. The output voltage swings to ground, and the device is housed in an 8-pin SOIC package.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • Extremely low power consumption with only 10 µA per amplifier
  • High input impedance with very low input current drift over temperature
  • Output voltage capability extends to ground rail
  • Stable operation with excellent phase margin on capacitive loads

Instrumentation, Op Amps, Buffer Amps Applications

  • Battery-powered instrumentation circuits
  • Low-power signal conditioning stages
  • Precision sensor interface applications
  • Portable measurement devices

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific suffix IDT corresponds to the SOIC-8 package and industrial/commercial temperature range as listed in distributor catalogs. Confirm RoHS compliance status through official manufacturer documentation before integration. Ensure ordering codes match the exact pinout and electrical grade required for the design. Cross-reference datasheet revisions to confirm parameter stability.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when ultra-low quiescent current is critical alongside moderate precision requirements. The CMOS architecture offers superior input bias current performance compared to JFET inputs at varying temperatures. Consider the 100 kHz bandwidth limit for high-frequency applications. Compare against TS27M2 or TS272 variants if higher speed or different power budgets are needed.

Instrumentation, Op Amps, Buffer Amps Part Context

This part belongs to the TS27L2 family of micropower, high-voltage CMOS operational amplifiers. The series includes variants with different power consumptions such as TS27M2 (150 µA) and TS272 (1 mA). The TS27L2 specifically targets applications requiring minimal energy usage while maintaining stable DC performance. The family shares similar architectural benefits including rail-to-ground output swing.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

TS27L2CDT serves as a direct functional substitute within the same family, differing primarily in package type (SOIC vs potentially other SOIC variations) and temperature range specifications. Verify pin compatibility and thermal characteristics when substituting.

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