TS3DDR32611ZQCR

Overview

The TS3DDR32611ZQCR is a specialized power management integrated circuit manufactured by Texas Instruments, designed specifically for PCDDR3 memory systems. It functions as a regulator converter providing 26 distinct output channels to support complex memory power requirements. The device operates with an input voltage range of 1.2V to 3.5V and delivers adjustable output voltages between 0.6V and 1.75V. It is housed in a 48-VFBGA package, specifically the Microstar Junior (4x4) format, suitable for surface mount installation. The component supports an operating temperature range from -40°C to 85°C and complies with RoHS3 standards.

Feature Summary

• Provides dedicated multi-output regulation tailored for PCDDR3 memory architectures
• Integrates 26 independent output channels within a compact footprint
• Supports wide input voltage ranges for flexible system integration

Applications

• PCDDR3 memory subsystem power distribution
• Embedded systems requiring specialized DRAM voltage regulation
• Industrial or commercial hardware utilizing PCDDR3 interfaces

Procurement Notes

Verify current availability status as this component has been marked as obsolete by the manufacturer. Check for end-of-life notifications and transition plans. Confirm that any alternative sources are authorized distributors or certified surplus suppliers. Ensure compatibility with existing PCB layouts when sourcing replacements. Validate RoHS3 compliance documentation for regulatory adherence in final assemblies.

Selection Notes

Select this component only if the design specifically requires PCDDR3 regulation with 26 outputs. Evaluate the 48-VFBGA package constraints against board space limitations. Consider the -40°C to 85°C operating range against environmental conditions. Assess the 1.2V to 3.5V input requirement against available system rails. Note that obsolescence may impact long-term supply chain stability.

Part Context

This part belongs to Texas Instruments' portfolio of specialized power management ICs focused on memory applications. It addresses the specific voltage sequencing and regulation needs of PCDDR3 technology. The Microstar Junior packaging allows for high-density mounting in space-constrained electronic devices. It represents a niche solution within the broader PMIC category, targeting legacy or specific industrial memory interfaces.

Replacement Considerations

Public confirmed substitute part numbers: None identified.